MIL-DTL-83425A
4.5.4 Wearability. When specified in the contract or purchase order, the design and material properties
that might cause discomfort or affect wearability of the earcup shall be determined by subjective
evaluation through actual wear and usage of the earcup by a group of selected individuals. The
wearability test shall be conducted by the procuring activity (see 3.5.3).
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD or in-house
contactor personnel, these personnel need to contact the responsible packaging activity to ascertain
packaging requirements. Packaging requirements are maintained by the Inventory Control Point's
packaging activities within the Military Service or Defense Agency, or within the military service's system
commands. Packaging data retrieval is available from the managing Military Department's or Defense
Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging
activity.
6. NOTES
(This section contains information of a general or explanatory nature which may be helpful, but is not
mandatory.)
6.1 Intended use. The earcup covered by this specification is intended to be worn with the HGU-26/P
flight helmet to protect the ears of personnel against high intensity sound.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification
c. Packaging requirements (see 5.1).
6.3 Tin whisker growth (see 3.3.5). The use of alloys with tin content greater than 97 percent, by
mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from
a day to years after manufacture and can develop under typical operating conditions, on products that
use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the
formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin
whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for
Electrodeposited Coatings of Tin).
6.4 Additional reference document (see 4.3.2). The following document is not directly referenced
herein, but should be used as a guideline.
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Preparation of Test Reports.
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