MIL-DTL-18239E(AS)
(Application for copies should be addressed to the Institute for Interconnecting and
Packaging Electronics Circuits (IPC, Inc), 2215 Sanders Road, Suite 200 South, Northbrook, IL
60062.)
2.4 Order of precedence. In the event of a conflict between the text of this document and
the references cited herein, the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been
obtained.
3. REQUIREMENTS
* 3.1 First article. When specified (see 6.2), a samples shall be subjected to first article
inspection in accordance with 4.2.
3.2 Design and construction. Unless otherwise specified (see 3.4) the equipment shall meet
with all the applicable requirements of MIL-E-5400, Class I for design and construction.
3.3 Insulating and case materials. Insulating and case materials shall meet the following
requirements, as applicable.
* 3.3.1 Laminated plastic material. Laminated plastic material shall be in accordance with
MIL-I-24768/13, type FBE.
* 3.3.2 Molded plastic material. Molded plastic material shall be in accordance with
ASTM D 5948. Type CFG shall be used where electrical properties are predominant. Type
CFI-5 shall be used where mechanical properties are predominant.
3.3.3 Case material. Case materials shall be of steel, flame retardant modified polyphenylene
oxide or other suitable magnetic shielding material. The earphone shall have a jet black finish
except the front magnetic shield. The front magnetic shield shall be protected against corrosion
by plating if applicable.
3.3.4 Insulating and impregnating compounds. Under all service conditions and test
conditions specified in section 4 of this specification, the compounds including varnishes, and
waxes shall preserve the dielectric strength of the insulation to which it is applied. A compound
shall not, either in the state of it's original application or as a result of aging under severe service
conditions, show any injurious effect upon the insulation it is designed to protect, and shall not
cause corrosion or deterioration of adjacent metal or plastic parts.
3.3.5 Magnetic materials. The materials used in the magnetic circuit shall be so processed
and assembled, that the earphone will not suffer degradation in performance because of loss of
magnetization, over long periods of service use or storage.
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