MIL-DTL-13253E
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor
personnel, these personnel need to contact the responsible packaging activity to ascertain packaging
requirements. Packaging requirements are maintained by the Inventory Control Point's packaging
activities within the Military Service or Defense Agency, or within the military service's system commands.
Packaging data retrieval is available from the managing Military Department's or Defense Agency's
automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature which may be helpful, but is not
mandatory.)
6.1 Intended use. The handsets covered by this specification are intended to be used with wire and
radio communication equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Title, number, and date of the applicable specification sheet and the applicable type number (see
c. Packaging (see 5.1).
d. First article inspection, when required (see 3.2).
6.3 First article inspection. Information pertaining to first article inspection of components covered by
this specification should be obtained from the procuring activity for the specific contracts involved (see
3.2).
6.4. Nomenclature. The parentheses in the nomenclature will be deleted or replaced by a letter
identifying the particular design; for example: AN/PIQ-1W.
6.5 Tin whisker growth (see 3.3.3). The use of alloys with tin content greater than 97 percent, by
mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from
a day to years after manufacture and can develop under typical operating conditions, on products that
use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the
formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin
whiskers. For additional information on this matter, refer to ASTM B545 (Standard Specification for
Electrodeposited Coatings of Tin).
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