MIL-DTL-13253E
3.3 Materials. Materials shall be as specified herein. However, when a definite material is not
specified, a material shall be used which will enable the handsets to meet the performance requirements
of this specification. Acceptance or approval of any constituent material shall not be construed as a
guaranty of the acceptance of the finished product.
3.3.1 Fungus resistant materials (see 4.7.11). The product shall be constructed of fungus-inert
materials, and shall show no evidence of fungus or other corrosion, which may cause a mechanical
failure. Following the above referenced test, the operational talk signal shall not degrade due to fungus
and shall be in accordance with 3.8. The contractor may refer to requirement 4 of the military handbook
titled "General Guidelines for Electronic Equipment", for additional information and guidance on fungus-
resistant materials (see 6.8).
3.3.2 Solder. There shall be no evidence of "cold soldering" and the use of excessive amounts of
solder will not be acceptable. Solder shall be solid or rosin flux-cored in accordance with composition
Sn97Pb3. Soldering materials and methods shall be as specified in J-STD-004, J-STD-005, and J-STD-
006.
3.3.3 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and
externally. Tin content of handset components and solder shall not exceed 97 percent, by mass. Tin
shall be alloyed with a minimum of 3 percent lead, by mass (see 6.5).
3.3.4 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or
environmentally preferable materials should be used to the maximum extent possible, provided that the
material meets or exceeds the operational and maintenance requirements, and promotes economically
advantageous life cycle costs.
3.4 Design and construction.
3.4.1 Wire, magnet. Magnet wire shall conform to NEMA MW 1000.
3.4.2 Finish. The equipment shall be finished in accordance with MIL-F-14072 and the equipment
drawings.
3.4.3 Connections. Soldering leads, lugs, and terminals shall be silver-plated or tin lead alloy coated.
Wires subject to breakage at the connections shall be provided with terminals that grip the wire insulation.
Solder-less terminals may be used on tin lead alloy coated standard wire, in power or audio circuits. But,
other wire connections shall be soldered. Where practicable, wire soldered to terminals shall be looped
at least once and not more than twice around the terminals before soldering, or equivalent means shall be
employed. Textile insulation ends of wires shall be secured against fraying by mechanical means or by
application of varnish conforming to ASTM D3955.
3.4.4 Earphone elements. The earphone elements shall be tested to and shall meet the first article
and conformance requirements of MIL-M-13189.
3.4.5 Microphone elements. The microphone elements shall be tested to and shall meet the first article
and conformance requirements of MIL-M-13189.
3.4.6 Switch assembly. The switch shall conform to the specified drawing (see 3.1).
3.4.7 Cord assembly. The cord and cord assembly shall conform to the specified drawing (see 3.1).
3.4.8 S-hook assembly (when applicable). The S-hook assembly shall conform to the specified drawing
(see 3.1).
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